PCB Design Ltd

Mastering Design for Excellence(DFx) in High-Speed PCB Design

Achieving success in Signal Integrity and

 

Date:  10.05.2023.

Major topics were:

  • Optimal stackup planning – from EMI, reflection and crosstalk perspective
  • Loss optimalization of various track geometries
  • Minimizing the time for EQ/ TQ process
Download the PPTWatch presentation on Youtube

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Design for Manufacturability (DFM) is a crucial aspect of PCB design, but in today’s challenging PCB designs, engineers need to go beyond just manufacturability to ensure that their designs are optimized for cost, assembly, and performance. Design for Excellence (DFx) is a concept that encompasses various aspects of design, including Design for Assembly (DFA), Design for Test (DFT), and Design for Cost (DFC), among others.

In this webinar, we will focus on the DFx aspects of high-speed PCB designs, where we need to find the right balance between signal integrity and manufacturing considerations. Using the state of the art simulation tools, We will discuss the major topics that affect the design of high-speed PCBs and explain how we can use simulation to optimize our designs.

 Optimal stackup planning is critical for high-speed PCB designs, as it helps reduce EMI, reflection, and crosstalk. We will show how simulation can help us choose the optimal stackup for our designs.

Loss optimization of various track geometries is another important aspect of high-speed PCB designs. We will discuss various track geometries and demonstrate how we can optimize them for signal integrity and manufacturability using simulation.

Finally, we will discuss how we can minimize the time for EQ/TQ processes by making material and stackup changes, adjusting impedance by the manufacturer, and using optimal D-code. We will show how we can use simulation to test and optimize these changes.

By the end of this webinar, you will have a clear understanding of the DFx aspects of high-speed PCB designs and how you can use simulation to optimize your designs for signal integrity and manufacturability.